发明名称 ELECTROPLATING PROCESS
摘要 <p>- This invention relates to a process and composition for the preparation of an electrodeposit which contains; at least one metal selected from the group consisting of nickel and cobalt or; binary or ternary alloys of the metals selected from nickel, iron, and cobalt; which comprises passing current from an anode to a cathode through an aqueous acidic electroplating solution containing at least one member selected from nickel compounds and cobalt compounds and which may additionally contain iron compounds providing nickel, cobalt and iron ions for electrodepositing nickel, cobalt, nickel-cobalt alloys, nickel-iron alloys, cobalt-iron alloys or nickel-iron-cobalt alloys and containing an effective amount of at least one additive; the improvement comprising the presence of 10 micromoles per compound or salt thereof having the formula: R1-S-S-R2 wherein R1 and R2 are independently selected from , and where n is an integer from 0 to 5, X1 is selected from -OH,-NH2, , and or salts thereof and X2, X3 and X4 are independently selected from -H, -OH, -NH2, , and simultaneously hydrogen; for a time period sufficient to form a metal electroplate upon said cathode. - i</p>
申请公布号 CA1070637(A) 申请公布日期 1980.01.29
申请号 CA19760261686 申请日期 1976.09.21
申请人 M & T CHEMICALS INC. 发明人 HARBULAK, EDWARD P.
分类号 C25D3/16;C25D3/14;C25D3/56;(IPC1-7):25D3/12;25D3/56 主分类号 C25D3/16
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