| 摘要 |
A modular electronic system having cooling means has a plurality of stacked electronic circuit units. Each stackable circuit unit has a rectangular frame having a pair of end members which support a plurality of spaced-apart, cooling channels. A cooling passageway extends through each channel along the length thereof and communicates with a cavity in each end member. The cavities form integral entrance and exit plenums for a fluid coolant when a plurality of the circuit units are stacked and aligned. A plurality of dual in line packages or other discrete electronic circuit packages are thermally coupled to one side of the channels with the leads from the packages extending between the channels to the other side thereof where they are connected by wave soldering to a printed circuit board. The individual circuit units are electrically interconnected by male contacts on a transverse member of the frame which cooperate with female contacts on electrical connection boards. A clamping arrangement holds the stacked circuit units in alignment and mounting plates having orifices therein communicating with the circuit unit cavities are provided at the ends of the stack to form a continuous cooling passage, so that fluid coolant is adapted to pass through each of the channels to cool the dual in line packages thereon. Several cooling channel configurations are provided. The circuit units may also be used with modular systems of the type having entrance and exit plenums which are separate from the stacked circuit units.
|
