发明名称 MANUFACTURING METHOD FOR SEMICONDUCTOR LUMINESCENT DEVICE
摘要 PURPOSE:To form a lens-shaped section easily and precisely to a required position on an end surface from where luminescent beam is radiated, by painting a chemical substance, that is solidified when a ultraviolet ray is irradiated on it, on the end surface of a semiconductor luminescent element chip; then solidifying the substance to form the lens-shaped section. CONSTITUTION:A resin 107 made of a polyacrylate that is solidified by an ultraviolet ray, is painted to an end surface of a laser diode chip 101. The light ray is emitted from the end surface. When the forward current is supplied to the laser diode chip 101, it produces the light. This light ray is received by a photofiber 109, and a light receiving element 110 and a meter 111 locate a position that receives the maximum amount of the ray. Then a light from a high pressure mercury lamp is introduced through a lens 112 to the other end of the photofiber 109, thus solidifying the polyacrylate that is painted on a section of an area 114. Then the unsolidified polyacrylate on the end surface of the laser diode is flushed away.
申请公布号 JPS5512774(A) 申请公布日期 1980.01.29
申请号 JP19780085807 申请日期 1978.07.13
申请人 MITSUBISHI ELECTRIC CORP 发明人 IKEDA KENJI;HIGUCHI HIDEYO;HORIKIRI KENJI
分类号 G02B6/42;G02B3/00;H01L33/58;H01L33/62;H01S5/00 主分类号 G02B6/42
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