METHOD AND APPARATUS FOR SELECTIVELY ELECTROPLATING AN AREA OF A SURFACE

摘要

A METHOD AND APPARATUS FOR SELECTIVELY ELECTROPLATING AN AREA OF A SURFACE The present invention relates to a method and apparatus for selectively plating an area of a substrate surface. A contact mask is provided for masking at least one charged anode, spaced from the surface, with a dielectric member which is maintained between the anode and the surface, along their corresponding opposed surface areas, out of contact with the surface. The surface is cathodically charged. The masked anode is contacted with a stream of an electroplating electrolyte. The stream of electrolyte then contacts at least a portion of the charged surface, including the area to be plated, to fully flow electrolyte thereover to selectively electroplate the area.