发明名称 ETCHING SOLUTION FOR TITANIUM
摘要 PURPOSE:Composite etching solution of titanium, being in no danger of attacking Cu2O in thick film paste, SiO2 in base board etc., containing water and each fixed ratio of benzotriazol, H2O2, NH4OH and/or NH4 salt against water. CONSTITUTION:Composite material for etching of Ti, containing water and 0.1- 5g, especially 0.3-3g, of benzotriazol, 30-120ml, especially 38-100ml, of H2O2, a fixed amount of NH4OH (aqueous ammonia) and/or NH4 salt against 50ml of water. On this occasion, 0.5-10ml, especially 1-5ml, or aqueous ammonia and 2-30g, especially 6-20g, of NH4 salt (for example, diammonium phosphate) against 50ml of water, are used. Water soluble Ti complex is formed by chelation action of benzotriazol in the above composite material and Ti etching action is given. Also, ehelation action is accelerated by H2O2 as catalyst and basic solution is made by aqueous ammonia and destruction of insulator is prevented and also, etching action of Ti is accelerated.
申请公布号 JPS5511120(A) 申请公布日期 1980.01.25
申请号 JP19780082685 申请日期 1978.07.07
申请人 TOKYO SHIBAURA ELECTRIC CO 发明人 SAITOU TAMIO;TAKEHARA YUKIO
分类号 C23F1/14;C23F1/38;H01L27/01 主分类号 C23F1/14
代理机构 代理人
主权项
地址