Thickened anode contact Schottky diode production - involves electroplating by passing current in forward direction through diode to plating anode

摘要

Semiconductor diodes are produced on a semiconductor wafer with a continuous metal layer on its underside, serving as the cathode connection. Anode contacts corresponding to the individual diodes are provided on the top surface, insulated by a silica layer and strengthened by electroplating. The plating anode is placed in the electrolyte near the anode contacts on the semiconductor wafer. The cathode layer (6) is connected to the plating plant cathode (7) so that current flows in the forward direction through individual p-n junctions to corresponding anode contacts on which the plated reinforcement (9) is deposted.