| 摘要 |
PURPOSE:To enhance insulation characteristics, and resistance to chemicals and heat, and to form high sensitivity photoresist having practical characteristics, by introducing acrylate groups in an aromatic polyamide acid. CONSTITUTION:An aromatic polyamide acid, such as products resulting from an aromatic diamide compound and an aromatic tetracarboxylic acid derivative and (meth)acryloyl chloride or glycidyl (meth)acrylate in an amount of 0.001 to 10 moles per mole of monomer unit are reacted in a polar organic solvent below 150 deg.C. Photopolymerization initiator(s) selected from carbonyl compounds, peroxides, azo compounds, S compounds, and halogen compounds are added preferably by 0.1 to 10 wt.% based on the polymer to a solution prepared by redissolving the above reaction product after precipitation separation in order to remove this solvent or impurities. |
