发明名称 Thermoplastic molding compositions
摘要 A thermoplastic molding composition having improved mold release properties is provided, the composition comprising a thermoplastic resin selected from the group consisting of a high molecular weight linear polyester and a high molecular weight block copolyester, from about 0.1 to 4.5% by weight, based on the total composition, of a polyolefin or olefin-based copolymer, and, optionally, from about 0.02 to 0.5% by weight, based on the total composition, of talc.
申请公布号 US4185047(A) 申请公布日期 1980.01.22
申请号 US19770866008 申请日期 1977.12.30
申请人 GENERAL ELECTRIC 发明人 COHEN, STUART C
分类号 C08L23/00;C08K3/34;C08L7/00;C08L21/00;C08L33/00;C08L33/02;C08L67/00;C08L67/02;C08L71/00;C08L101/00;(IPC1-7):C08L67/06 主分类号 C08L23/00
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