发明名称 |
METHOD FOR COATING OF POLYIMIDE BY ELECTRODEPOSITION |
摘要 |
<p>A METHOD FOR COATING OF POLYIMIDE BY ELECTRODEPOSITION A method of coating a copper substrate comprises the steps of: anodically microsmoothing the copper substrate in an acid bath to provide a substantially smooth surface; electrocoating the microsmoothed substrate with a pin hole free nickel film having a thickness of between about 2.5 microns to about 12.5 microns; single step, nonaqueous electrocoating the microsmoothed, nickel coated substrate with a pin hole free polyamic acid polymer, and curing the polyamic acid coating to form a polyimide film free of copper ion contamination.</p> |
申请公布号 |
CA1070262(A) |
申请公布日期 |
1980.01.22 |
申请号 |
CA19760262763 |
申请日期 |
1976.10.05 |
申请人 |
WESTINGHOUSE ELECTRIC CORPORATION |
发明人 |
GASS, WILLIAM R.;SCALA, LUCIANO C.;PHILLIPS, DAVID C. |
分类号 |
C09D5/44;C25D13/20;H05K3/02;(IPC1-7):25D5/48;25D9/02 |
主分类号 |
C09D5/44 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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