| 摘要 |
<p>A slicing apparatus is disclosed which slices a cylindrical ingot (3) into disc-shaped wafers by a rotating blade (2). The slicing apparatus includes an ingot support device (9, 10, 11, 12, 13, 16, 17, 21) which is used to contact support the ingot (3) at a position opposed to the position of the ingot (3) to be sliced by the blade (2). Therefore, a reaction force which is produced in the ingot (3) slicing can be supported by the ingot support device (9, 10, 11, 12, 13, 16, 17, 21), thereby eliminating any ill effects on the hold surface of the ingot (3).</p> |
