| 摘要 |
PURPOSE:To make a loose wire straight at the second bond section by moving a tool beyond the second bond section and reversing it when moving the bonding tool into the second bond section. CONSTITUTION:A wire 3 is through the bonding tool 1 and the wire 3 is pressurized and attached to the external electrode 4 at the point of the tool 1. Then, while the wire 3 is drawn out from a through-hole the tool 1 is moved on a semiconductor 6, when the tool 1 is moved beyond the electrode 7 at the second bond and the tool 1 is reversed into the electrode 7 at course 8. The wire 3 drown out too much from the through-hole 2 is staighten up at the second bond section with the bending power obtained when the tool 1 moved back to the electrode 7. As a result, the insulating space between the wire 3 and the semiconductor chip at the second bond section is maintained to make it very difficult to short. |
