| 摘要 |
<p>PURPOSE:To enable free attachment and detachment of microcomputers by loading a wiring board with microcomputers and circuit elements which generate no heat, by housing the wiring board in a hole of one circuit board, and by sealing circuit elements loaded on the other circuit board which generate heat in a sealing space defined by both boards and the casing. CONSTITUTION:A circuit board 2A is loaded with circuit elements 4 which generate less heat such as chip capacitors, and the other circuit board 2B with circuit elements 4 which generate heat such as power transistors. A casing 6 is formed in a frame shape to define a sealing space 14 by spacing the boards 2a, 2B out as specified. A hole 5 is bored in position in one board 2A, and a wiring board 8 loaded with microcomputers 7 and a plurality of circuit elements 4 related with the microcomputers 7 is housed in the space defined by the hole 5 and connected to conduction paths on the other board 2B. This design allows free attachment and detachment of microcomputers with circuit elements hermetically sealed by a casing and two circuit boards.</p> |
