发明名称 PACKAGE FOR DEMOLDING EMBOSSED BUTTER AND MARGARINE
摘要 <p>A package of butter or margarine which is molded with multi-cubic dimensioned embossments permits the contents of the package to be demolded within the temperature range of 38.degree. to 48.degree.F without damaging the embossments. The package comprises a film-sheet within the thickness range of 0.005 to 0.20 inch which is thermoformed into a single-walled, unlined cup-like cavity, and butter or margarine is flow filled into the cavity. The side wall of the cavity has an inward taper of an angle no less than 5.degree. in non-embossed portions of the side wall. Peaks of the embossed surface have radii 01.degree. no less than 1/32 inch and angles of no less than 20.degree..</p>
申请公布号 CA1069757(A) 申请公布日期 1980.01.15
申请号 CA19760256434 申请日期 1976.07.06
申请人 PETERS, LEO 发明人 PETERS, LEO
分类号 A23C15/00;(IPC1-7):23C15/00 主分类号 A23C15/00
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