| 摘要 |
PURPOSE:To prevent shortcircuiting between fine metal wire and element terminal, by providing a projection on a lead supported by a semicondcutor element fixing part constituting a lead frame. CONSTITUTION:Projection 6 is provided on lead 2 supported by the element fixing part of a lead frame at the boundary of upper metal mold 4 and lower metal mold 5, which are for sealing resin. The lead frame so constructed is held by these metal molds and extended by the fastening pressure of the metal molds. Element fixing part 1 is placed lower than internal lead 3 provided in the lead frame. By this, the fine metal wire connecting the electrode of the element and the internal lead is prevented from coming into contact with the terminal of the element, and thereby shortcircuiting is prevented. |
