| 摘要 |
PURPOSE:To prevent shortcircuiting between neighboring fine metal wires, by providing a depression, of size sufficient for inserting an element, on the element fixing part of a vessel or a lead frame on which semiconductor elements are mounted. CONSTITUTION:A depression of size sufficient for inserting element 21 is provided on semiconductor element fixing part 23 of a lead frame having lead 24. Element 21 is fixed here. The electrode provided on this element and lead 24 are connected by means of fine metal wire 25. Or, a depression of size sufficient for inserting element 31 is provided on element fixing part 33 of ceramic vessel 32, as used in housing elements, and element 31 is fixed here. By this, the elements are prevented from shifting, and also contact and shortcircuiting among many leads are prevented.
|
