发明名称 PREPARATION OF PLATE FOR LEAD ACCUMULATOR
摘要 PURPOSE:To increase the strength of deposition while lengthening life, by using thermal plastic resin, which melting temperatures is lower than the quality of mat body material, as a binder, and by employing mat bodies, to which the resin is impregnated. CONSTITUTION:Mat bodies 4 are contacted with two sides of a structure, to which active material 3 is filled, thermal plastic resin, which melting point is lower than the mat bodies, is impregnated to the mat bodies 4, and the mat bodies are thermally deposited to a synthetic resin frame body 2, thus obtaining a positive plate. The thermal plastic resin impregnated to the mat bodies 4 is deposited so as to cover the whole mat body fibers, mostly exists in the crossing portions of fibers and firmly holds the mat bodies when it is deposited to the synthetic resin body 2. Thus, the strength of deposition can be enlarged while its life can be lengthened.
申请公布号 JPS554842(A) 申请公布日期 1980.01.14
申请号 JP19780077697 申请日期 1978.06.27
申请人 SHIN KOBE ELECTRIC MACHINERY 发明人 ISHIKAWA YUUZABUROU;ONGA TOSHIYUKI;HAYAKAWA TAKUMI;NAKANISHI TSUTOMU;IKARI SHINICHI
分类号 H01M4/20;H01M2/16;H01M2/18;H01M4/76 主分类号 H01M4/20
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