发明名称 DEVICE FOR PARTIALLY PLATING BOTH SIDES OF LEAD FRAME
摘要 <p>PURPOSE:To obtain a partial plating uniform in thickness and appearance and enhanced in the area precision at the time of partially plating both sides of a lead frame. CONSTITUTION:Insoluble anodes 13 and 13' in upper and lower jig parts formed so that the surface areas of the anodes except the openings are the same as or larger than the surface area of the lead frame to be partially plated. The distances between the anodes 13 and 13' and the surface of the lead frame 5 are made the same or the distance between the upper anode 13 and the lower surface of the lead frame 5 is made shorter than the distance between the lower anode 13 and the surface of the lead frame 5, and a partition wall is provided in the passage for the plating soln. passed through the lead frame 5 to divide the passage into plural independent discharge passages 14. A soln. outlet 15 is furnished to collect the soln. to be discharged at the end of the upper jig part A and to discharge the soln. outside the system.</p>
申请公布号 JPH0598489(A) 申请公布日期 1993.04.20
申请号 JP19910282234 申请日期 1991.10.02
申请人 SUMITOMO METAL MINING CO LTD 发明人 TANAKA SHIGEHARU;WADA KEISUKE
分类号 C25D5/02;H01L23/50 主分类号 C25D5/02
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