| 摘要 |
<p>PURPOSE:To requlate the mounting position of leads, installed at the four corners on a ceramic package, in the level direction of the package by providing the leads with projections which engage the bottom surface of package. CONSTITUTION:The ceramic package 10 is composed of a ceramic base 12, a ceramic frame 13 stacked on the base 12, and a cap 14 put on the frame 13. In this case, a large number of metalized layers 18 extending from the side to the bottom surfaces through the underneath of the frame 13 are disposed on the upper surface of base 12, and a semiconductor IC chip 22 is secured to a recess at the center of base 12 through the metalized layer 20. In the next step, respective electrodes on the chip 22 are coupled to the metalized layer 18 by use of bonding wires 26 and secured in a line at the side of package to the corresponding leads. In this constitution, the leads 16A-16D are provided with positioning projections 16b which, through punched holes 16a, can engage the bottom surface of package, thus accuring that the leads can be aligned in the level direction.</p> |
