| 摘要 |
PURPOSE:For effective heat radiation, one surface of an electronic part is fixed to heat resistant insulating substrate, and the other surface is attached to heat radiating metal plate. CONSTITUTION:The main surface of a heat resistant insulating substrate 1 such as polyimide film is attached with conductive wire 3 and the other surface is bonded to electronic part 4 such as LSI chip by using adhesive 6. The substrate 1 has throughholes 2 through which the surface electrode of the electronic part is connected to the conductive wire 3. Preferably, the holes 2 are shaped in taper. The other face of the electronic part 4 is bonded to a radiating metal plate 10, using adhesive 9. The metal plate 10 has an extension 11 to be fixed to the external. The metal plate 10 can have an area which is not limited by the electronic parts, thus providing great radiation effect. |
