| 摘要 |
<p>PURPOSE:To obtain a film carrier having the structure with which the outer lead, such as a flexible printed wiring board and the like, and the electrode of the printed wiring board can be junctioned excellently requiring no excessive installation area on the wiring board. CONSTITUTION:A sheet of solder foil 8 is fixed to the tip of the group of outer leads 31 connected to a semiconductor device 4, the outer leads 31 are held in the above-mentioned state, and the bending and lift, generating when a film carrier 10 is transferred or aligned, can be prevented. The outer leads 31 of the film carrier 10 and the electrode 72 of a PCB 7 are aligned, they are pressure-welded using a heating tool and the like and are connected by melting the solder foil 8.</p> |
