| 发明名称 |
TAB TAPE OR LEAD FRAME, AND RESIN MOLD |
| 摘要 |
PURPOSE:To provide a TAB tape that causes no complexity in a semiconductor manufacturing process and allows molding resin to flow uniformly into upper and lower molds. CONSTITUTION:A TAB tape 10 for molding semiconductor chips 12 is clamped between the upper mold 20 and lower mold 30 of a transfer molding machine. The tape includes through holes 14 for passing molding resin in areas adjoining and near the regions of molding M. |
| 申请公布号 |
JPH06252217(A) |
申请公布日期 |
1994.09.09 |
| 申请号 |
JP19930033177 |
申请日期 |
1993.02.23 |
| 申请人 |
APIC YAMADA KK;SHINKO ELECTRIC IND CO LTD |
发明人 |
YAMAGUCHI TATSUYOSHI;WADA NORIO;UCHIDA HIROFUMI |
| 分类号 |
B29C45/02;B29C45/26;B29L31/34;H01L21/56;H01L21/60;H01L23/50;(IPC1-7):H01L21/60 |
主分类号 |
B29C45/02 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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