| 摘要 |
PURPOSE:To detect the etching ending point of a polymeric organic compound film without leaving any residue of the film. CONSTITUTION:By performing the pre-treatment of plasma treatment on an object to be treated by using a gas containing boron after completing dry etching, a gas containing fluorine and another gas containing oxygen are activated in a discharge chamber and the activated active species 1 is introduced into a reaction chamber and, at the same time, another active species 2 is generated by directly introducing a gas containing hydrogen into the reaction chamber and causing the gas to react with the species 1 so that a polymeric organic compound can be removed and an etching ending point can be detected by detecting light in a visible ray region emitted from the surface of the object to be treated with a photoelectric conversion means. |
