发明名称 Self-aligned contact process
摘要 A method for forming a self-aligned contact utilizes a thin insulating layer formed on the upper surface of a conductive layer. A barrier layer is deposited over the insulating layer, and gate electrodes are then defined. Sidewall spacers are formed along the vertical sidewalls of the gate electrodes. During formation of the sidewall spacers the barrier layer protects the gate electrodes. A second insulating layer is then deposited and a via is opened to the substrate. A contact can now be created by depositing conductive material into the via.
申请公布号 US5369303(A) 申请公布日期 1994.11.29
申请号 US19930116050 申请日期 1993.09.02
申请人 SGS-THOMSON MICROELECTRONICS, INC. 发明人 WEI, CHE-CHIA
分类号 H01L21/28;H01L21/302;H01L21/3065;H01L21/336;H01L21/60;H01L21/768;H01L23/522;H01L29/78;(IPC1-7):H01L29/78;H01L29/44 主分类号 H01L21/28
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