发明名称 MOLDED CIRCUIT BOARD
摘要 A moulded circuit board construction provides a precise and economical means for mounting and interconnecting electrical components thereon. Guide holes for components with extended leads may be precisely located, and a moulded countersink provided therefore, thus facilitating manufacture, especially with automatic component insertion techniques. The board construction also provides a convenient means for integrally moulding thereon component sockets, inductor posts, mounting flanges, edge connectors and the like. A moulded circuit board pallet (10) Figure 1 includes a first circuit board (12) moulded integrally with a second circuit board (14) score lines are provided at 16, 18, to facilitate removal of the boards 12, 14 from the pallet 10. Mounting holes for the extended heads of electrical components are provided at 20, with each hole provided with a countersink indentation. <IMAGE>
申请公布号 AU3763178(A) 申请公布日期 1980.01.03
申请号 AU19780037631 申请日期 1978.06.29
申请人 MOTOROLA, INC. 发明人 DOMINIC RALPH ERRICHIELLO
分类号 H05K1/00;H05K1/02;H05K1/18;H05K3/30;H05K3/36;H05K3/42;H05K7/06;(IPC1-7):H05K7/06;H05K7/08;H05K5/02 主分类号 H05K1/00
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