发明名称 LARGE SCALE INTEGRATION (L.S.I.) SKIVEKONSTRUKSJON OG FREMGANGSMAATE FOR FREMSTILLING AV L.S.I-SKIVEKONSTRUKSJONEN
摘要 LSI chip construction having a semiconductor body with a plurality of transistors formed in the semiconductor body in a predetermined pattern and a plurality of resistors formed in a semiconductor body in a predetermined pattern. Means is provided which includes two layers of metallization having input and output pads adjacent the outer perimeter of the body and contacting said transistors and resistors to form a plurality of emitter-follower circuits with certain of the emitter-follower circuits being made up of larger transistors and being located near the perimeter of the chip and near the input-output pads. The other emitter coupled circuits are clustered in groups to form an array of such groups with each of the groups being capable of containing a plurality of logic circuits.
申请公布号 NO141623(B) 申请公布日期 1980.01.02
申请号 NO19730002814 申请日期 1973.07.09
申请人 AMDAHL CORPORATION, 发明人 BUELOW, FRED KARL,;ZASIO, JOHN JOSEPH,
分类号 H01L21/822;H01L21/82;H01L23/522;H01L27/04;H01L27/118;(IPC1-7):01L23/50;01L27/04 主分类号 H01L21/822
代理机构 代理人
主权项
地址