| 摘要 |
An apparatus is provided for transferring semiconductor wafers from one conveying or transport mechanism to another in a manner that substantially reduces wafer damage. The apparatus comprises first and second sensors; first, second and third rollers; a motor with a drive shaft coupled to the first and second rollers for applying a rotational force thereto; and a pneumatic unit coupled to a movable platform on which the rollers are mounted and operable for applying a lifting force to or removing a lifting force from the movable platform. The rollers are mounted parallel to and coplanar with each other and are positionable above or below the belts of a two-belt conveyor mechanism, the first roller being disposed for vertical movement between the belts of the conveyor mechanism, and the second and third rollers being coupled by two belts forming a transport mechanism for transporting wafers to or from the conveyor mechanism. In response to detection of a passing wafer on the conveyor mechanism by the first sensor, the pneumatic unit applies a lifting force to the movable platform, thereby causing the first and second rollers to lift the passing wafer from the conveyor mechanism, and the motor rotates the first, second and third rollers counterclockwise, thereby causing the lifted wafer to be transported from the conveyor mechanism onto the transport mechanism. The transport mechanism also operates in the lifted position to transport wafers to the conveyor mechanism when the motor rotates the first, second and third rollers clockwise. In response to detection by the second sensor of a wafer passing on the transport mechanism towards the conveyor mechanism, the pneumatic unit removes the lifting force from the movable platform, thereby lowering it and causing the first and second rollers to deposit the wafer onto the conveyor mechanism. These transfers of wafers to and from the conveyor mechanism are performed without interference with the operation of the conveyor mechanism and without damage to the wafers.
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