Bonding thermoplastic resins

摘要

Bonding between thermoplastic resins and inorganic oxide substrates is improved by providing to the resin/inorganic oxide interface as an adhesion promoter a combination of (a) a copolymer of an ethylenically unsaturated organic monomer and an unsaturated organosilane containing hydrolyzable groups; and (b) a monomeric hydrolytically reactive organosilane.