| 摘要 |
PURPOSE:To obtain the title composition suitable for leveling abrasion of surface of silicon crystal, glass and quartz wafer especially suitable as supporting substrates of electric integrated circuit, containing water, granular amorphous silica and a specific polymer microgel. CONSTITUTION:The aimed composition containing (A) water, (B) usually 0.1wt.% (preferably 1-5wt.%) granular amorphous silica having 5mmu-1mu average particle diameter and (C) usually >=1ppm (preferably 10-1,000ppm) polymer microgel obtained by subjecting acrylamide and acrylic acid to crosslinking polymerization. The composition is preferably adjusted to pH8-12 with an alkali metal, amine or ammonia. |
