| 摘要 |
<p>PURPOSE:To prevent the deterioration of characteristics at the time of built-in processing, by making the following a basic unit; an inner layer substrate on which a print resistor is mounted, a prepreg substrate which is bonded to a print resistor mounting surface of the inner layer substrate and unified in a body, and a single-side or both side printed circuit board which is bonded to the prepreg substrate surface and unified in a body. CONSTITUTION:On both surfaces of an insulating substrate 1 on which a print resistor is mounted, a single-side or double-side circuit board 2a is laminated by interposing an electrically insulative prepreg substrate 3a between them. Each of them is mutually bonded and unified in a body, to constitute a basic unit. On the circuit board 2a, single-side or double-side circuit boards 2b, 2c are laminated via prepreg substrates 3b, 3c, to constitute a multilayer printed circuit board, in which the following are formed according to the respective purposes; a through hole 4, a via hole 5 and a blind via hole 6. Thereby, the deterioration of characteristics at the time of built-in processing can be prevented.</p> |
