| 摘要 |
<p>PURPOSE:To improve the yield and reliability by resin-sealing after sealing one part of a lead wire and a semiconductor pellet by using a plastic-based thermal shrinkage tube. CONSTITUTION:Lead wire 2' with projection part 4 and pellet 1 are sealed at a low temperature by polyolefin-based thermal shrinkage tube 5 with its internal surface coated with an adhesive fused by heating. Next, tube 5 and lead projection part 4 are completely resin-sealed 6. In this constitution, a device can be obtained which withstands shock tests and mechanical strain and is excellent in moistureproofness.</p> |
