发明名称 |
Process for the deposition of pure semiconductor material |
摘要 |
In a device and process for the deposition of pure semiconductor materials, especially silicon, by thermal decomposition of gaseous compounds of said semiconductor materials on carrier bodies heated to decomposition temperatures, wherein the device consists of a metallic base plate, mounting means and electrical connections thereon for heating the carrier bodies, as well as pipe connections for supply and exhaust of said gaseous compounds, and a bell-shaped cover slipped onto the base plate and forming a gas-tight seal therewith, the improvement that the area of the bell-shaped cover facing the reaction space consists of silver or silverplated steel. A removable heating element is used to preheat the carrier bodies and a cylinder disposed about the bell forms therewith a closed annular cooling chamber.
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申请公布号 |
US4179530(A) |
申请公布日期 |
1979.12.18 |
申请号 |
US19790003060 |
申请日期 |
1979.01.12 |
申请人 |
WACKER-CHEMITRONIC ELEK GRUNDSTOFFE |
发明人 |
GRIESSHAMMER, RUDOLF;HAMSTER, HELMUT;KOPPL, FRANZ;LORENZ, HELMUT |
分类号 |
C01B33/035;C23C16/22;C23C16/44;C30B25/08;(IPC1-7):B05D5/12 |
主分类号 |
C01B33/035 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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