| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a receptacle having a small connector propagation delay time and a high density by using a modular structure arranged with a plurality of columns laterally, and arranging the contact reception sections of first columns and the contact reception sections of second columns in offset each other. SOLUTION: The module 54 of a second column is molded with many contact members 66 in a wafer 68, and receptacle sections 70 are coupled with mating connector pins inserted from the opening sections 44 of a case 40. The opening sections 44 of the case 40 are arranged in an interruption pattern and are offset for each column. The module of a first column has the same structure, the number of contact members is less by one, the receptacle sections of the first columns are located at the height between the second columns, and their tail sections are located alternately with the tail sections 72 of the second columns. A plurality of first and second modules are connected laterally via a pair of pegs and holes and inserted into the case 40 to form a high-density receptacle.</p> |
