| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a manufacturing method of photointerrupter capable of manufacturing the photointerrupter in high resolution without breaking a light emitting element and a photodetecting element at all also capable of changing the slit size requiting of no expensive metallic mold in the case of forming the optical path slits of the photointerrupter. SOLUTION: A light emitting element 1 and a photo detecting element 2 loaded on a lead frame 4 are inner-connected, after molding their peripheries with a phototransmittable resin 5 whose surfaces are covered with a flare stopping material which is partly removed to form the slits 5a for optical paths in the manufacture of the photointerrupter. In the forming step of the slits 5a for optical paths, a photosetting material 6 is used as for the flare stopping material while the slits 5a for optical paths are formed by the exposure using a mask 7.</p> |
