| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a cleavage method for a semiconductor laser substrate, in which cleavage defects such as breakage and crack are significantly reduced in cleaving and separating a semiconductor laser substrate into a bar shape. SOLUTION: In a cleavage method for a semiconductor laser substrate using a cleavage device, which has at least a holder 9 for holding a pressure-sensitive adhesive member 7 for mounting a semiconductor laser substrate 1 having a plurality of scribe flaws 61 , 62 and 63 formed thereon along a cleavage direction and a cover member 8 for covering the semiconductor laser substrate 1, and a push-up member 13 arranged below the pressure-sensitive adhesive member 7 for pushing up the semiconductor laser substrate 1 mounted on the pressure-sensitive adhesive member 7, cleavage is started from the scribe flaw 62 near the center of the semiconductor laser substrate 1 by the push-up member 13.</p> |
