LAMINATION METHOD OF SEMICONDUCTOR CHIP AND SEMICONDUCTOR DEVICE USING THE SAME

摘要

PROBLEM TO BE SOLVED: To prevent contamination on an electrode on a wiring board and deformation of a wire connecting an electrode pad of a semiconductor chip and a wiring board by preventing outflow of adhesive when a plurality of semiconductor chips are laminated. SOLUTION: When a semiconductor chip is laminated by using insulating adhesive 6 three-dimensionally, a positive load is prevented from being applied to a layer of the insulating adhesive 6 which is not yet set in a assembled module, when the layer of the insulating adhesive 6 is thermally set. More specifically, an assembled module is installed in reverse inside a heating furnace during heat treatment and load applied to an insulator layer is made negative. Or a semiconductor chip 7 of an uppermost layer is supported from above and is installed inside a heating furnace, and positive load applied to an insulator layer is minimized.