| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and a system for mutually connecting conductive elements in an integrated circuit. SOLUTION: This method includes a step for forming a lower-side conductive element 14, which has a lower-side contact member 22, having a width 24 that is substantially not larger than the width of a member adjoining the lower-side conductive element 14. A first insulator layer 18 is formed on the outside of the lower-side conductive element 14. An upper-side conductive element 16 is formed on the outside of the first insulator layer 18. The upper-side conductive element 16 has an upper-side contact member 28, having a width 30 that is substantially not larger than the width of a member adjoining the upper-side conductive element 16. A second insulator layer 20 is formed on the outside of the first insulator layer 18 and of the upper-side conductive element 16. A contact hole 40 is formed in the first insulator layer 18 and the second insulator layer 20, resulting in the exposure of a lower-side contact region 42 of the lower-side contact member 22 and an upper-side contact region 44 of the upper-side contact member 28. In the contact or hole 40, an interconnect 54 is formed that mutually connects the contact region 42 of the lower-side conductive element 14 and the contact region 44 of the upper-side conductive element 16. |
