发明名称 |
Electronic circuitry |
摘要 |
An electronic circuit in which a heat pipe is mounted on a substrate for transporting heat from one region to another, the heat pipe also being secured to the substrate at a plurality of positions along the heat pipe for the purpose of increasing the stiffness of the substrate. The heat pipe may extend across a surface of the substrate or around an edge of the substrate. Heat conductive paths from the heat source may be provided by a ground plane within the substrate or a heat conductor may extend from the heat source to the heat pipe at a position spaced from the substrate.
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申请公布号 |
US6008987(A) |
申请公布日期 |
1999.12.28 |
申请号 |
US19980062773 |
申请日期 |
1998.04.21 |
申请人 |
NORTEL NETWORKS CORPORATION |
发明人 |
GALE, GEOFFREY N.;WATKINS, JOHN H. |
分类号 |
H05K1/02;H05K7/20;(IPC1-7):H05K7/20 |
主分类号 |
H05K1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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