发明名称 ULTRASONIC WIRE BONDING UNIT
摘要 PURPOSE:To perform the ultrasonic wave bonding with high reliability, by making adjustable the tilt of the wire extending to the guide hole of wedge and by making replaceable the wedge. CONSTITUTION:The L-shaped arm 19 is fitted at the external wall of the containing box of the driving mechanism of the clamper 6 with the bolts 18, in removable free and adjustably. The guide rod 20 is fixed at the side surface of photo end of the arm 19, and the wire is supported by projecting the rod under the wire 8 extended between the spool 7 and the wedge 2. When the bonding distance is long, bonding is made by fitting the 30 deg. wedge to the horn 5. This wire takes about 30 deg. and the support of the rod 20 is not required. When the bonding distance is shorter, the 60 deg. wedge is used in place of the 30 deg. wedge. The bolt 18 is loosen, the arm 19 is turned, the wire 8 is supported with the rod 20, the direction of wire between the rod 20 and the guide hole is made in agreement with the angle 30 deg. of the guide hole of the wedge to perform bonding. Thus, the yield rate is high and the line bonding with high reliability can be made.
申请公布号 JPS54159175(A) 申请公布日期 1979.12.15
申请号 JP19780067804 申请日期 1978.06.07
申请人 HITACHI LTD;AKITA DENSHI KK 发明人 FUJIWARA SHIYUNICHI;MORIYA ATSUSHI
分类号 B23K20/00;H01L21/60;H01L21/607 主分类号 B23K20/00
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