| 摘要 |
PURPOSE:To sinter a substrate wafer coated with a photosensitive resin uniformly without being affected by the open air, by covering the surrounding of the substrate with an inert gas heated through reflux in the hot plates. CONSTITUTION:The substrate wafer 2 coated with the resist 2a is transferred by air bearings from the conveyance part 1a to the sintering surface 3a previously heated up to the given temperature and put on the surface 3a. An inert gas, e.g., nitrogen gas, heated by reflux through the pipe 3C in a hot plate is jetted from the nozzles 3b focing each other and the sourrounding of the wafer 2, particularly the top surface, is covered with the gas layer 3d and 3e. The substrate wafer 2 is isolated completely from the open air by the inert gas layer heated as high as the hot plate 3 and good sintering can be carried out for given hours. After sintering, the wafer 2 is transferred from the sintering surface of the hot plate 3 to the conveyance part 1b of the next step by the air bearing. |
