发明名称 |
Heat-removing can for electronic component |
摘要 |
The operational heat of a semiconductor chip (1) is transferred to a cooling can (5) by means of a metal cushion (7). The metal cushion is permanently connected to the can or the chip on one side whilst its opposite side is in loose contact. This creates a connection of high thermal conductivity without exposing the chip to inadmissible mechanical stresses. <IMAGE> |
申请公布号 |
CH614810(A5) |
申请公布日期 |
1979.12.14 |
申请号 |
CH19770008238 |
申请日期 |
1977.07.05 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORP. |
发明人 |
NICHOLAS GEORGE KOOPMAN;PAUL ANTHONY TOTTA |
分类号 |
H01L23/373;H01L23/433 |
主分类号 |
H01L23/373 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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