Covering chipboard panel with cellulosic sheet - contg. thermoplastic polymer fibrils for hot bonding under pressure without using adhesive or resin impregnant

摘要

Chipboard is covered with a 2-layer sheet, the layer contacting the surface of the chipboard comprising a blend of cellulosic fibres and fibrils of a thermoplastic polymer in a wt. ratio 10/99-55/45 and having a surface area >=1 m2/g. The second layer also comprises above blend in a wt. ratio 100/0-55/45. the sheet is bonded to the chipboard by applying pressure at a temp. between 35 degrees C and the m. pt. of thermoplastic polymer. The sheet does not need to be impregnated with a resin and no adhesive is required. The thermoplastic polymer is a polyolefin, pref. polyethylene.