| 摘要 |
<p>PURPOSE:To prevent the exfoliation occurring on the interface between the resin and the heat sink and thus to prevent deterioration of the anti-moisture performance for the high-output and resin-sealed semiconductor device by giving the warp corresponding to the size difference caused by the difference of the hardened shrinkage and the expansion of the resin between the resin and the heat sink. CONSTITUTION:The copper or the like is used for heat sink 11 to form the resin- sealed semiconductor device, and the silica-filled epoxy resin or the like is used for sealing resin 16. And in case the heat hardening is given at the fixed temperature, the warp caused by the copper or the like and featuring a depth of about 0.08% the entire length of heat sink 11 is provided at the center area of 11 in such way that the attachment surface of semiconductor element 13 may be formed convex. After this, element 13 is attached via solder material 12 to one surface of heat sink 11, and then element 13 is connected to external draw-out lead 15 via metal thin wire 14.</p> |
