发明名称 |
COMPOUND SEMICONDUCTOR WAFER AND MANUFACTURE THEREOF |
摘要 |
PROBLEM TO BE SOLVED: To provide a compound semiconductor wafer wherein a semiconductor device of high gate breakdown voltage is manufactured. SOLUTION: A compound semiconductor substrate is etched and acid-cleaned as a pre-process for forming an epitaxial growth layer on the surface of the compound semiconductor substrate, and the compound semiconductor substrate which is pre-processed is placed in a gas comprising carbon atom such as atmosphere, carbon dioxide, methane gas, so that the accumulated layer of carbon atom is formed on the surface of the compound semiconductor substrate before epitaxial growth.
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申请公布号 |
JP2000182960(A) |
申请公布日期 |
2000.06.30 |
申请号 |
JP19980353070 |
申请日期 |
1998.12.11 |
申请人 |
SUMITOMO ELECTRIC IND LTD |
发明人 |
TSUBOKURA MITSUTAKA;NANBU KATSUMI |
分类号 |
H01L21/205;H01L21/338;H01L29/778;H01L29/812;(IPC1-7):H01L21/205 |
主分类号 |
H01L21/205 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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