| 摘要 |
A panel assembling method is disclosed which comprises the steps of coating a thermosetting adhesive on the connection area of a first panel to be fixed to the connection area of a second panel, mating the connection areas of the first and second panels, heating a portion of the connection area of the first or second panel to set the adhesive on the portion, by passing a current, possibly a high-frequency current, through the portion between electrodes which are contacted to it, thereby temporarily assembling the first and second panels, and subsequently heating all of the connection area of the first or second panel to set the adhesive entirely on the connection area. An apparatus for partially setting the thermosetting adhesive is also disclosed. |
