| 摘要 |
PROBLEM TO BE SOLVED: To provide the manufacture method of a substrate, whose thickness of a conductive region with which a via is filled is not restricted by the thickness of a patterned metallic layer and in which conduction layers which are mutually connected by the conductive via are installed on both faces. SOLUTION: A dielectric layer 100, where conduction layers 102 and 112 are deposited or stacked on one surface or both surfaces of a substrate, is used. Laser drill work is used for piercing a non-through via 104, which passes through a dielectric and stops at the boundary of the substrate and the conduction layer. For establishing electrical connection to the conduction layer, the via is filled with a conduction material 106 through an electrolytic plating process. A second conduction layer 108 is deposited o stacked on the other surface of the substrate. |
