| 摘要 |
<p>PURPOSE:To minimize the malformation of the sealed part and thus to increase the light transmission efficiency by forming with resin both the light emitting device and the photo detector in parallel to the longer axis of the light transmissible resin sealed part which encloses ovally the both elements. CONSTITUTION:Light emitting device 7, photo detector 8 and IC chip 18 are joined to lead 12, 13 and 14 of lead frame 17 each and then commected to lead 15. Devices 7 and 8 are then sealed 19 via the light transmissible resin, and furthermore the non-light transmissible resin is injected to the fixed region 20 form the direction of arrow 21. Lead frame 17 is cut off at cutting line 22, and thus IC circuit 24 sealed by forming resin 23 is obtained excluding coupling bar 16. Thus the forming resin is injected from direction 21 which is parallel to longer axis direction 25 of resin sealed part 19 featuring an oval shape, and accordingly the forming resin flows along the longer axis after hitting the narrow-width area of part 19. Thus the malformation of part 19 can be reduced extremely after injection of the resin.</p> |
