| 发明名称 |
COMPONENTE A SEMICONDUTTORI PROVVISTO DI UN SUBSTRATO DI SOPPORTO DIELETTRICO E PROCEDIMENTO DI SOPPORTO DIELETTRICO E PROCEDIMENTO PER LA SUA FABBRICAZIONE |
| 摘要 |
A semiconductor component of a semiconductor or circuit system is provided. The circuit incorporates a dielectric carrier comprised of synthetic material. The circuit is provided with plate-shaped semiconductor islands. The islands possess doping layers and are interconnected as desired with a thin film wiring. A process for the production of such product is also provided. |
| 申请公布号 |
IT1039441(B) |
申请公布日期 |
1979.12.10 |
| 申请号 |
IT19750024864 |
申请日期 |
1975.06.27 |
| 申请人 |
SIEMENS AG |
发明人 |
|
| 分类号 |
H01L21/70;H01L21/00;H01L21/312;H01L21/764;H01L21/822;H01L21/84;H01L23/31;H01L23/522;H01L27/00;H01L27/04;(IPC1-7):H01L/ |
主分类号 |
H01L21/70 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
