| 摘要 |
PURPOSE: To solve the problem that the temperature of a heat generating element 3A is restricted within a range which is narrower than the proper temperature control range of the element 3A, because a heating body 13 is integrated with a cooling jacket 4 and the element 3A is cooled by the jacket 4 even during the period in which a wafer W is heated by the heating body 13. CONSTITUTION: A wafer temperature controller 10 is provided with a heating body 13 which heats a wafer chuck 12, a cooling body 14 which comes into contact with the heating body 13 through seal members 19 and 19A, and a temperature sensor 16 which is inserted into the recessed section 12A of the chuck 12. The controller 10 is also provided with a PID controller 17 which controls the heating body 14 according to the temperature detected by means of the sensor 17. The cooling body 14 is brought nearer to or farther from the heating body 13 by making a communicative hole 14B communicating with a gap 8 formed between the heating body 13 and cooling body 14 through the seal members 19 and 19A in the cooling body 14, connecting a vacuum pump 21 to the hole 14B through a selector valve 22, and then, adjusting the pressure in the gap δ to a low pressure or atmospheric pressure by controlling the valve 22 through the PID controller 17. |
