| 摘要 |
<p>The semiconductor device comprises two circular semiconductor plates (10, 11) arranged one on the top of the other with, in between, a metal washer (12). Other me washers (13, 14) are placed respectively above t top plate (11) and below the bottom plate (10). On the metal washers (12, 13, 14), connection terminals (23, 24) are fixed said connection terminals coming out of the casing (20) on a same side. The stack of semiconductor plates (10, 11) and metal washers (12, 13, 14) is mounted, through a ceramic disc (16), on a base (26) provided with a threaded bolt (18). To ensure a good thermal conduction from the top semiconductor plate (11) to the base (26), the bottom semiconductor plate (10) has a bigger diameter. The top metal washer (13) presents a recess or an aperture allowing a control terminal (25) to come into contact with the top semiconductor plate (11).</p> |
