| 摘要 |
PURPOSE: An image sensor is provided to reduce fabricating cost and to prevent corrosion of a pad region for wire bonding generated in a color filter process, by omitting an expensive color filter process performed regarding the image sensor. CONSTITUTION: A plurality of optical sensing devices(42) are formed on a substrate(41) at regular intervals. A transparent insulation layer(43) is formed on the entire surface of the substrate including the optical sensing device. A plurality of optical blocking layers(44) are formed on the transparent insulation layer at regular intervals to prevent light incident upon a region except the optical sensing device. A multiple slit(45) is formed on the transparent insulation layer between the optical blocking layers so that visible rays transmit the multiple slit. A plurality of metal compounds(46) separate colors regarding the visible rays penetrating the multiple slit, formed inside the transparent insulation layer.
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